Ellie Gabel discusses how computing at the thinnest scale drives breakthroughs in quantum technologies, ultra-thin chips and atomic layer devices that can change the future of computing.
Computing has progressed exponentially in just a few decades. Even if internal components are reduced, computing power is increasing by an order of magnitude.
Still, the world’s most powerful computers are limited to bulky form factors and complex optical setups.
New technology presents new problems. Quantum computers, for example, are sensitive to the smallest perturbations. Condensed components can be rewarded, but the approach poses many technical challenges.
What if there was a way to reduce the electronics and use much fewer parts without affecting performance?
The researchers finally answered this burning question and found that the race’s finish line for atomic-scale computing can be seen.
If it appears impossible, sub-nanoscale chips have been developed. If it is scalable, this technology could revolutionize computing.
Ultrathin Chip Technology Sees Breakthroughs
Computing at the thinnest scale possible is not about hub arrogance, but about speed, efficiency and performance.
Supercomputers are extremely powerful, but reminiscent of old, bulky personal computers. Highly controlled scale requires conditions that are difficult.
Practical quantum computers are important for next-generation computing, and miniaturization is the key to unlocking them.
Photons are typically accessed into quantum states by complex optical devices such as waveguides. Entanglement allows data to be encoded and processed in parallel.
This interaction is notoriously difficult to scale because incompleteness can decompose the calculation.
Harvard University’s Faculty of Engineering and applied science optical researchers have made a major leap into room temperature quantum computing by leveraging nanoscale technology.
They developed a new metasurface, a two-dimensional device etched in nanoscale patterns to control the behavior of electromagnetic waves.
Replacing a traditional setup with one ultra-thin chip eliminates the need for complex and bulky optical components.
Their miniature, error-resistant quantum metastalls, produce intertwined photons, making quantum networks more reliable and scalable. This solution is cost-effective, easy to manufacture and does not require complicated alignment.
The trend towards miniaturization of semiconductor manufacturing shows that such breakthroughs will not be confined to academic circles for a long time.
Functional sizes reach less than 5 nanometers and sub-nanometer solutions on the horizon – precision manufacturing advances rapidly.
The science behind atomic scale computing
The race to atomic scale computing needs to start somewhere. Thermal dissipation is one of the most pressing challenges facing research and development teams. The amount of thermal electronics increases exponentially as it decreases.
At nanoscale thicknesses, electrons are more likely to collide with the surface of the wire, increasing waste heat, resulting in rapid increase in the electrical resistance of copper wire.
Increased power capacity to offset performance losses is out of the question. The overall key is miniaturization. This issue limits the scale and efficiency of nanoscale computing technologies.
Stanford Engineering researchers have developed an innovative solution to this problem, biobium phosphide. This ultra-thin material is produced more than copper in films with only thick atoms.
Copper is worsened when conducting electricity at a thickness of about 50 nanometers, but it works well at room temperature and at 5 nanometers.
Two-dimensional materials are the basis of computing at the thinnest scale. Another research team discovered that atomic layer devices made up of tungsten direnide (WSE2) have a very strong nonlinear optical reaction.
They use thousands of photons, which is much more efficient than optical fiber for long distance communication.
Fiber optic networks are fast, but electrical processing generates excessive waste heat and introduces delays. WSE2 uses a small number of photons to process information and improve communication efficiency.
The original equipment manufacturer can apply this breakthrough to quantum computing.
Current status of research and development
There are many notable R&D milestones in which prototypes and discoveries are steadily emerging from industry and academia.
Many focus on quantum computing. The application may be a niche, but the findings are fooled and inspire progress.
Take a look at one recent quantum dot breakthrough, for example. Researchers at the Lawrence Livermore National Laboratory have pioneered new techniques for depositing quantum dots on corrugated surfaces of liquid engineering.
This innovative approach eliminates the need for post-processing and significantly improves device scalability and performance.
Near-infrared photodetectors are the basis of detection technology. Performance is prioritized, but compact form factors cannot be negotiated, especially with state-of-the-art defense, biomedical and security systems.
An imaging system must simultaneously detect light of multiple wavelengths on a single chip. However, depositing quantum dots on textured surfaces is difficult.
This new application approach offers cost-effective, scalable alternatives that could revolutionize the production of medical devices, communication systems and home appliances.
The path to computing at the thinnest scale
The original equipment manufacturer hasn’t applied its recent breakthrough on a large scale, but it’s already looking forward to it.
They’re right – this industry moves fast. Once they achieve sub-nanoscale production, will they proceed to purification of atomic layer devices?
What’s next for computing at the thinnest scale?
An assessment of the current state of semiconductor and electronics manufacturing provides a clearer picture of the industry’s future outlook.
The US manages only 12% of the global semiconductor manufacturing capacity. Congress passed the Chips Act to encourage resumes, but manufacturers remain limited by the rarity of rare earth element sediments.
As of 2025, China is leading the world in miniaturization of electronics. Already, Chinese researchers have used molecular beam epitaxy to avoid traditional limitations on crystal growth.
This approach offers unparalleled structural control, ensures perfect alignment and significantly reduces manufacturing defects.
In theory, China can use this method to generate up to 50 layers per minute, with up to 15,000 semiconductor layers.
At just atomics of thickness, ultra-thin chips revolutionize computing. Getting to the market first with efficient mass production methods can permanently tilt the scale.
Innovation is beneficial regardless of where it occurs. But today’s actions will shape the technology landscape of tomorrow, affecting supply chains and market competition.
Policymakers need to pay attention to material integration and device engineering breakthroughs.
Put pressure on scientists and policymakers
New manufacturing techniques are primarily proof of concept, but there are commercialization paths.
As functional sizes approach the sub-nanometer scale, engineers need to continue to explore ways to enable sophisticated computing operations. The more efficient the design, the more energy you can invest in actual calculations.
The mass production finish line for next-generation atomic layer devices is quickly approaching. Anyone who first reaches it controls the market.
Cross-border collaboration with scientists, industry experts and policy makers is extremely important at this stage.
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